SmartX ECP 6.3 introduces cross-NIC, multi-link RDMA bonding to deliver true high availability for latency-sensitive workloads. By combining OVS-based bonding with RDMA software multipathing, it elevates redundancy from port-level to NIC-level, enabling seamless failover without compromising microsecond-level latency. This upgrade addresses long-standing issues such as MAC flapping and unpredictable reconnections, providing financial-grade reliability for mission-critical applications while maintaining high performance.
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SmartX builds powerful and simple-to-use computing and data infrastructures, elevating IT to focus on application and innovations that power their business.
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